Mastering Every Bond.
Perfecting Every Seal.
Advanced Packaging Options
Flange Package
C-X Band
Output Power: 200W~
Base Station, Radar, Satellite
mmWave Top-Side Cooling
Ka-W Band
Output Power: 100~200W
Radar Communication, 5G mmWave
Overmold QFN
L-X Band
Output Power: ~50W
Base Station Radar
Air-Cavity
X-K Band
Output Power: 100~200W
5G mmWave, Radar, Satellite
TSSOP
S-C Band
Output Power: 100~150W
Base Station, Radar, Satellite
For more Information
Advanced Packaging Capabilities
Pre-Packaging Data
RF On Wafer Test
Our Semi-Auto Rack-and-Stack system integrates R&S ZNA43 (40GHz, 4-port) and Anritsu MS4647 (E-Band) VNAs to deliver high-precision measurements. By capturing critical RF performance at the wafer level, we validate your design and predict post-packaging insertion loss before final assembly.
Precision at the final gate.
Final Testing
- Solder EVB
- Johnstech Socket
- Customized (Rack & Stack) RF System
- Drain Sense for HPA
- 10GHz Test Tation
Every component undergoes rigorous electrical validation before shipment.
We set the standard for quality, ensuring that every delivered unit aligns
perfectly with your design specifications
The precision to start
The strength to last.
One Stop, Low Loss
ISO 27001 Certified
Integrated by design. Delivered as one
We are your production extension. We don’t design, but we optimize the build. With one contact point for all packaging and testing, we deliver consistency from prototype to high-volume production.
Advanced Packaging Capabilities
We deliver advanced packaging solutions to meet rigorous thermal and signal requirements. Our expertise including Overmold QFN, Air-Cavity, Flange Package, and mmWave Top-Side Cooling packages provides the precision engineering needed to bring your complex designs to market.
High-Power Pulsed Measurement
For high-power pulsed measurement, our platform supports pulsed power levels exceeding several hundred watts.
Mastering Every Bond.
Perfecting Every Seal.
Advanced Packaging Options
Flange Package
C-X Band
Output Power: 200W~
Base Station, Radar, Satellite
mmWave Top-Side Cooling
Ka-W Band
Output Power: 100~200W
Radar Communication, 5G mmWave
Overmold QFN
L-X Band
Output Power: ~50W
Base Station Radar
Air-Cavity
X-K Band
Output Power: 100~200W
5G mmWave, Radar, Satellite
TSSOP
S-C Band
Output Power: 100~150W
Base Station, Radar, Satellite
For more Information
Advanced Packaging Capabilities
Pre-Packaging Data
RF On Wafer Test
Our Semi-Auto Rack-and-Stack system integrates R&S ZNA43 (40GHz, 4-port) and Anritsu MS4647 (E-Band) VNAs to deliver high-precision measurements. By capturing critical RF performance at the wafer level, we validate your design and predict post-packaging insertion loss before final assembly.
Precision at the final gate.
Final Testing
- Solder EVB
- Johnstech Socket
- Customized (Rack & Stack) RF System
- Drain Sense for HPA
- 10GHz Test Tation
Every component undergoes rigorous electrical validation before shipment.We set the standard for quality, ensuring that every delivered unit alignsperfectly with your design specifications
The precision to start
The strength to last.
One Stop, Low Loss
ISO 27001 Certified
Integrated by design. Delivered as one
We are your production extension. We don’t design, but we optimize the build. With one contact point for all packaging and testing, we deliver consistency from prototype to high-volume production.
Advanced Packaging Capabilities
We deliver advanced packaging solutions to meet rigorous thermal and signal requirements. Our expertise including Overmold QFN, Air-Cavity, Flange Package, and mmWave Top-Side Cooling packages provides the precision engineering needed to bring your complex designs to market.
High-Power Pulsed Measurement
For high-power pulsed measurement, our platform supports pulsed power levels exceeding several hundred watts.