Package
Infared Dector Series
Uncooled Infrared Detector Housings
- Ceramic-based lightweight structure with compact, cost-effective design
- Large cavity core area optimized for high-density chip mounting
- CLCC/PGA compatible, supporting mainstream 17μm to 10μm pixel pitches
- Versatile applications ranging from security to smart grid & ADAS systems
Infrared Cooled Tube Assembly
- Premium ceramic-metal hybrid structure for Dewar & cooling system integration
- Ultra-high sensitivity & long-range detection for military & scientific research
- High-reliability hermetic sealing with next-gen lightweight, low-density materials
- Flexible 20 to 70 pin configurations to meet diverse custom requirements
CQFN Series
CQFN
Optimized ceramic-based design specifically engineered for GaAs/GaN microwave chip packaging.
Compact and lightweight structure that delivers superior thermal and electrical performance.
Exceptional RF transmission supporting high frequencies from DC up to 40 GHz.
Ideal for high-frequency applications that require low-loss and high-reliability results.
Ultra High Power Amplifier Series
Ultra High Power Amplifier
Package with CuMo metal base for die attach, with ceramic insulator for RF input/output
- Air-cavity structure, sintered Ag, and ball/wedge bond compatible
- Supporting ultra high-power handling & delivering low-loss RF characteristics
- Outstanding reliability performance
Optical Communication Series
Mini-DIL Ceramic Packages
- Innovative 3D Stacking: Integrates multi-layer ceramics, copper pillars, and AuSn bonding for high-density vertical interconnects.
- Ultra-Fine DPC Lines: Delivers precise surface metallization with line widths and spacings down to 50 microns.
- Monolithic All-Ceramic Option: Integrates the rim and baseplate to eliminate metal frames, reducing weight and cost.
- Superior 3D RF Performance: Minimizes horizontal footprint while ensuring low insertion loss and excellent VSWR.
- Turnkey GJB-1420B Services: Offers custom design, Au-wire bonding, parallel seam/AuSn sealing, and hermeticity testing.
BOX Ceramic Packages
- Welded ceramic-to-metal feedthroughs support multi-channel, high-speed RF routing with internal/external pads.
- Integrated TEC compatibility features high-thermal-conductivity baseplates for advanced laser cooling.
- Multi-lane ceramic striplines enable parallel packaging to maximize data transmission bandwidth.
- Flexible sealing options fully accommodate both hermetic and non-hermetic application environments.
- Custom co-simulation services provide expert RF routing, thermal management, and stress designs.
- Rigorous reliability testing delivers comprehensive electrical performance and environmental profiling.
Ceramic Butterfly Packages
- Brazed ceramic-to-metal frames feature single or dual-sided fiber-optic conduits (optical windows) for precise alignment.
- High-thermal-conductivity WCu baseplates ensure superior heat dissipation for high-power laser chips.
- Parallel seam welding compatibility delivers robust, defense-grade hermetic sealing and long-term protection.
- Tailored structural design provides custom housing configurations and custom interconnect topologies.
- Comprehensive reliability testing guarantees proven electrical performance and rigorous environmental profiling.
- Selective plating options offer customizable coating types and precise thicknesses tailored to unique application needs.
SIP Ceramic Packages
HTCC Ceramic Package
- Optimized HTCC ceramic architecture specifically engineered to support high-density GaAs/GaN microwave chip packaging and SiP applications.
- High-density 30-layer routing capability supporting multi-channel isolation shielding and complex multi-tier ceramic cavities.
- Exceptional high-frequency performance delivering robust, low-loss RF signal transmission from DC up to 40 GHz.
- Versatile assembly compatibility, perfectly optimized for die attach, eutectic bonding, wire bonding, and BGA interconnects.
- Advanced power thermal management featuring AlN substrates and premium top metal heat sinks for high-power chip dissipation.
HTCC Engineered by co-firing premium Alumina or AlN green tapes with refractory metals (W, Mo, Mo-Mn) at extreme temperatures (1500°C–1900°C) to create rigid, multi-layer interconnected substrates.
Advanced Co-fired Process: Sintered at extreme temperatures (1500°C–1900°C) utilizing 90%-96% Alumina or AlN green tapes to form highly rigid ceramic substrates.
Multi-Layer Interconnects: Integrates precision metallized vias and refractory metal routing (W, Mo, Mo-Mn) to deliver robust internal connectivity.
DPC 3D SIP Ceramic Package
- Innovative 3D stacked architecture featuring single/multi-layer ceramic bases integrated with copper copper-frames and copper pillars via AuSn eutectic bonding.
- Ultra-fine DPC metallization capability achieving precise surface metal patterning with line widths and spacings down to 50 microns.
- Advanced multi-substrate vertical interconnects utilizing electroplated or electroless plated thick copper pillars to enable robust layer-to-layer integration.
- Minimized spatial footprint delivering ultra-high density and high integration by significantly reducing horizontal plane dimensions.
- Vertical 3D RF signal transmission offering exceptional radio-frequency performance with low insertion loss and excellent VSWR (Voltage Standing Wave Ratio).
- Ideal for high-density, high-frequency microsystems and next-generation advanced packaging applications
Ultra-fine 35μm thin-film lithography achieves ultra-precise surface metallization for extreme high-density patterning.
Premium NiAu/NiPdAu surface finishes (Au >0.4μm) deliver optimal reliability for advanced die attach and wire bonding.
High-density micro-via filling and laser direct writing significantly minimize signal noise and enhance high-frequency grounding.
Advanced build-up technology utilizes precision lamination and low-stress buffer layers to construct robust 3D structures.
Optimized surface refinement ensures minimal voiding during flip-chip bonding to maximize yield and performance.
Manufacturing Platform for Multilayer Ceramic Substrates and Integrated Housings
Advanced Packaging Options
On Wafer Testing
Probe Station
Probe
