- Die bonding process
- Die shear test
The push-pull force testing machine is used for process production monitoring, ensuring the stability of the production process.
Package Production Line are Located in the Class 10000 Clean Room
Including epoxy dispensing, stamping, die attach, Flip chip, C2/C4 and Eutectic process to meet different technical services requirement. The equipment accuracy is 3um@3 sigma, with the minimum chip size to 0.15mm.
The oven is an oxygen-free oven, capable of reaching temperatures up to 300°C, and is equipped with 6-point temperature monitoring for process control.
Process Control
The push-pull force testing machine is used for process production monitoring, ensuring the stability of the production process.
Package Production Line are Located in the Class 10000 Clean Room
Including epoxy dispensing, stamping, die attach, Flip chip, C2/C4 and Eutectic process to meet different technical services requirement. The equipment accuracy is 3um@3 sigma, with the minimum chip size to 0.15mm.
The oven is an oxygen-free oven, capable of reaching temperatures up to 300°C, and is equipped with 6-point temperature monitoring for process control.